Together we have over 25 years mechanical engineering experience, including 15 years of electronic packaging experience in the Silicon Valley.
Phillip is a recent grad of UC Berkeley with a B.S. in Mechanical Engineering. Phillip joined Dezign Shack as a intern machinist. He has moved on to design and fabricate many types of structures, including fiberglass, steel, aluminum, and plastic. He has designed sheet metal and IP67 plastic enclosures. He has designed and fabricated many fixtures. His interest includes fire dancing, 3D printing, and crochet.
Nick has a B.S. in Mechanical Engineering from Loyola Marymount University, CA. He is experienced in sheet metal and plastic electronic enclosures and test units. As well as, thermal management and layout of PCB boards, heat sinks, and connectors. His interest includes cooking bbq, dirt biking, fly fishing and surfing.
Bill has a B.S. in Mechanical Engineering from Southern Illinois University. He has consulted on designs from deep under the sea to the surface of Mars. His electrical packaging experience includes biomedical products, consumer products, and industrial products. He has the ability lead the design from concept to manufacturing and seamlessly address and solve any issues along the way. He has a broad experience background in thermals, EMI, cost reduction, and weight reduction. He has the vision to turn a concept into a design, prototype, and manufactured part. He has a very strong background in manufacturing and assembly abroad as well as Asia. His interest include motorcycles and dog training.